 Aries Electronics, Inc. has published its 8th Edition Short Form Catalog covering a range of interconnection and packaging products. The 12-page catalog includes the first sidestackable BGA socket available on the market, according to the company. Designated the Pin-Ball Socket, this device can be soldered side-by-side, directly to the existing footprint of a PC board, improving packaging density. Also detailed are the company’s Correct-A-Chip technology and products, which enable designers to convert virtually any package type or footprint to any other. Typical Correct-A-Chip products include DIP-to-PLCC adapters, standard DIP adapters, DIP-to-SOIC adapters, PGA adapters and many other “form-to” configurations while enabling designers to upgrade without board redesign or rework. Aries’ High-Frequency RF Test Sockets, which utilize the company’s patented Microstrip Contact System, are also covered in the catalog. Aries Electronics, Inc.
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