RF Micro Devices has planned to introduce new technologies developed by RFMD to enable levels of functional integration in RF applications. The technologies include hermetically sealed wafer level packaging (WLP), micro-electro-mechanical-systems (MEMS), integrated conformal shielding, gallium nitride (GaN), GaAs E/D pHEMT and GaAs BiFET. The company anticipates the new processes and enabling technologies will support the Company’s forecasted growth in calendar year 2008 and extend the Company’s reach into new cellular product categories, including cellular mode switches, filters, duplexers and other high performance RF components for cellular handsets.
The company also anticipates its technologies will expand its growth prospects in markets targeted by its formed Multi-Market Products Group (MPG), including wireless infrastructure, wireless access, standard products, broadband/consumer and aerospace & defense.
The company also anticipates its technologies will expand its growth prospects in markets targeted by its formed Multi-Market Products Group (MPG), including wireless infrastructure, wireless access, standard products, broadband/consumer and aerospace & defense.
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