Mattson Releases Alpine Photoresist Strip Product

Mattson Technology has released its Alpine system to meet the stringent requirements of advanced low temperature photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes with a single tool. The addition to Mattson's family of dry strip products, Alpine was developed to address the challenges of advanced low-k and other complex materials required to manufacture today's and future ICs. Alpine builds and expands on Mattson's latest production proven platform, the Suprema; and is designed for reliable, low-cost-of-ownership (COO) manufacturing for 65 nanometers and below. The Company noted that it has shipped its initial Alpine system to a major semiconductor manufacturer in Taiwan.