QuickLogic ViaLink Technology PolarPro II

QuickLogic Corp. has provided its engineering samples of next generation PolarPro II, the customer specific standard product (CSSP) platform for the connectivity, intelligence, and logic requirements of handheld applications are now available. Based on QuickLogic's patented ViaLink technology, the PolarPro II offers low power consumption combined with small-footprint packages. A low power (VLP) mode freezes system operation, during which the static current drops to less than 5 microamps. The QuickLogic's CSSPs implement system blocks (PSBs) in a base silicon platform, such as PolarPro II or ArcticLink. CSSPs then serve to meet the specific design requirements of OEMs/ODMs. The end result is a tested, customised device, along with the necessary software drivers for the host operating system.



The family builds on PolarPro platform, offering a compact architecture that allows for higher levels of integration in a single device. It is the silicon platform for delivering customer- or market-specific combinations of QuickLogic’s system blocks for storage, wired/wireless communication, video/imaging, security and other custom functions. The PolarPro II also enables higher design flexibility. The I/O section, for instance, now offers eight independently-powered banks to simplify integration into multi-voltage systems, eliminating the need for costly level-shifting circuitry.