Texas Instruments’ Ultra-Thin Chip Module

Texas Instruments Incorporated has released its module for contactless payment applications which removes another technology barrier for broader proliferation of contactless payment. The ultra-thin module enables card manufacturers to produce an increasing array of colorful and distinctive products with higher yields as a result of causing fewer visual imperfections than thicker chip modules. Using the TI ultra-thin module, the contactless payment chip, card manufacturers can create thinner PVC pre-laminate sheets for the contactless layer. The 280um (11mil) thin module enables the creation of pre-laminates as thin as 345um (13.6 mil). This allows the card manufacturers to print the card’s colorful artwork on thicker print stock while maintaining the 680-840um (26.8-33.1 mil) ISO standard for card thickness. Thicker print stock makes these complex cards more durable and able to survive multiple passes through a printing press during standard card manufacturing processes, translating to higher yields of finished cards. The module operates at low power, delivers a transaction speed (typically 120 milliseconds) and is developed with a sensitive radio frequency chip to enable a successful transaction the first time a customer taps the card to the payment reader. The module and payment application software operate in dynamic Card Verification Code (CVC) transaction authorization mode which offers issuers the highest level of security available.