FlipChip Partners with Unisem in Wafer Bumping, Wafer Level Packaging

Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI’s wafer bumping and wafer level packaging technologies. As part of the agreement, UAT will license FCI’s core technologies, including its premier Spheron technology. FCI will further solidify its investment in the partnership by becoming a shareholder of UAT.

FCI’s wafer bumping technology offers complete bumping solutions for fine pitch devices, including 0.125mm pitch densities and high-reliability applications requiring JEDEC Level 1 capability with the smallest form factor available. FCI’s Spheron technology is designed for high-frequency RF wafer level chip scale packaging and utilizes a new dielectric material, which offers improved electrical and mechanical performance in handheld advanced mobile devices and other demanding applications.

“This agreement comes at an ideal time, as the global demand for flip chip and wafer level packaging continues to grow significantly in market share due to the substantial cost savings, device size reduction and increased performance benefits,” said Bob Forcier, president and CEO of FlipChip International. “Entering into this licensing agreement with Unisem will not only provide benefits for both of our companies, it will make FCI’s wafer level technologies available to a host of new customers,”

“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp-up of its wafer bumping and wafer level packaging technologies, which will be quickly integrated into our existing full production environment.”