The space-saving advantages are combined with better audio performance and higher ESD protection compared to integrated or discrete alternatives. The integrated TVS diodes have a 20V peak clamping voltage, enabling the device to meet IEC61000-4-2 level 4 ESD protection at the external pins. Total harmonic distortion (THD) is less than -75dB, while the device achieves high audio-power transfer by delivering 135mA per speaker channel ensuring excellent sound reproduction. This is achieved thanks to the high thermal efficiency of the wafer-level flip-chip package, which supports 285mW total continuous power dissipation.
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