CPS AlSiC Large Format Integrated Heat Spreader Flip Chip Lids

CPS Technologies Corporation has offered AlSiC (Aluminum Silicon Carbide) metal matrix composite lids in large format for Systems in Package (SiP) devices used in workstations, servers, video processing, data communication products, internet routers and at high frequency and RF packaging applications where performance and reliability are critical. Compliant with RoHS, AlSiC metal matrix composite lids are available in large format for SiP devices used in workstations, servers, video processing, data communications products, and Internet routers. The AlSiC cast products can incorporate functional design features such pockets for memory chips, ridges for

reinforcement, bosses for alignment, and cavities or pedestals for die. Surface supports laser marking, paint, ink, and screen printing, as well as plating anodization. The AlSiC cast surface supports various identification methods including, laser marking, paint, ink, and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. The AlSiC meets the requirements of the Restriction of Hazardous Substances Directive (RoHS compliant) of the European Parliament.