Cool Polymers Inc. developed its CoolPoly for managing the heat output of increasingly light emitting diodes (LEDs). With inherent EMI/RFI shielding characteristics, the non-corrosive CoolPoly thermally conductive plastic provides low CTE and thermally conductive mass to help transfer/dissipate heat close from LEDs with no secondary interfaces at die level. At board level, it provides 3D molded substrates that transfer LED energy similar to ceramic boards and metal backed boards, and can be injection molded to net shape that serves as heat sink and mechanical enclosure at enclosure level.
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