Rudolph Releases Wafer Edge and Backside Macro Inspection Modules

Rudolph Technologies Inc. has released its E30 and B30 modules for wafer edge and backside inspection. Suitable for any production environment, the E30 and B30 modules are suited for inspection and in-line monitoring of 32 nm manufacturing processes from front end of line (FEOL) through final manufacturing. The edge defects as small as 2 µm on patterned, the production wafers can be detected. Part of all-surface Explorer Inspection Cluster, modules can also be used with NSX Series inspection systems commonly used in outgoing quality assurance and back-end fab applications.