ECN Asia
  Mark as your homepage Bookmark us Print Subscription
               
Saturday, November 22, 2008
Home About Us Current Issue Archive RSS Free Subscription Trade Shows Media Kit Contact Us

Boards & Modules

Computers, Peripherals & Networking Devices

Digital Den

Electromechanical/Mechanical Devices

Embedded Systems & Networking

Integrated Circuits & Semiconductors

Microwave & RF Components

Optoelectronics & Displays

Packaging & Interconnects

Passive & Discrete Components

Power Sources & Conditioning Devices

Sensors & Actuators

Software

Test & Measurement

Electronics Asia

Search:
 
  Advanced Search
Product Info Search:
 
     
 
 
 
Product News > Oct 2008
 
 
Ads by Google
 

Mezza-pede 1mm Low Profile SMT Connector System


(Product News, 08 Oct 2008 )

Mezza-pede 1mm SMT Connectors from Advanced Interconnections Corp. are designed for 1mm pitch micro board-to-board and flex cable-to-board applications. The screw-machined, low profile Mezza-pede Connector system is especially suited for high reliability applications such as providing power to a tunable laser since this connector passes mixed flowing gas (MFG) tests, ensuring continuous performance in the field.



The Mezza-pede Connectors are suitable for mezzanine board applications where z-axis space is a constraint. The patented pin and lead frame design is surface mountable and features screw-machined terminals with multi-finger contacts with a per contact current rating of greater than 1 Amp @ 80ºC. An over-molded lead frame seals the surface mount pins to prevent solder wicking and ensures a solid solder joint at the PCB level. Precision molded from high temperature LCP, the RoHS compliant, two-piece connector system is fully compatible with lead-free solder profiles.



Standard sizes include dual row 8- and 14-position models with other pin counts and optional enhancements such as shrouds for polarized mating available on a customized basis. A thru-hole header is also available. The product is packaged in tape and reel for automated assembly. Lead time is 2-4 weeks. Advanced Interconnections Corp. is an ISO 9001:2000 certified designer and manufacturer of electronic interconnect solutions.



 

Company : Advanced Interconnections Corp.
Product Code : 08KF009
http://www.advanced.com/pdf/AppNote_2007-02_BGA_Automotive.pdf

 
 
ADVERTISEMENT
 
 
 
Ads by Google
 
OUR SPONSOR
   
   
 
 
 
   
   
     
 
 
         
     
 
Related Articles
   
PCIe x8 Gen 2 cable adapter
PXI solid state high current switches
Technology benchmark on the ‘thinnest’ 2Gb LPDDR-400 PoP solution
Miniature circular connectors
Enhanced SMC board-to-board adapter
Low-cost 5W termination
SMT connectors offer secure mating retention
D-Sub connectors with stamped power contacts
Value addition is the key in distribution
Part three: ESD protection
   
 
Top News
   
Avnet, Xilinx and Texas Inst. Release Avnet Spartan-3A DSP FPGA / DaVinci Development Platform
ON Semiconductor Introduces Class AB Audio Amplifier
DC/DC Boost Mode Converter from Linear Technology
ON Semiconductor Introduces RGB LED Pixel Drivers
TI Introduces Zero-Drift Programmable Gain Amplifiers
Texas Instruments Introduces Single-Chip MSP430 MCU
Seagate Introduces Enterprise Hard Drive
Agilent Technologies Introduces Antenna Test Receiver
Agilent’s EMPro 3D Design Software for Analyzing the Electromagnetic (EM)
Micrel Launches Shrinking LDOs
   
  More News >>
 
     
     
 
         
 
 
     
         
 
spacer
Country Report
spacer
   
bullet

TAIWAN: Inductor technologies are developed independently

bullet

KOREA: Inductor manufacturers are highly competitive, but scarce

bullet

CHINA: World’s high-volume producer of transformer, coil and inductor

bullet

TAIWAN: Moderate but steady growth in LED market

bullet

KOREA: LED has a bright future in our homes

  more on country report >>
   
 
spacer
Our Sponsor
spacer
   
bullet
 
   
 
     
 
     
 
spacer
Features
spacer
   
bullet

Cost effective replacement to quartz crystals

bullet

Audio power amplifiers and Zobel networks

bullet

Practical implementations of digital power

bullet

Military productivity factors in large FPGA designs

bullet

Going green: Increasing flyback converter efficiency

  more on features >>
   
 
Distribution
   

Outsource test solution services in Asia

The five commandments of outsourcing

Dealing with distributors even when there are manufacturers around

Value addition is the key in distribution

Distributors supply solutions, not just parts

  more on distribution >>
   
 
     
         
 
 
     
         
 
Industry Focus
   

Ethernet adoption encourages open protocols

Managing Bluetooth profiles: A billion served

Enabling a true wireless multimedia home network

Bluetooth paves the way for truly wireless car interiors

Eliminating massive clock trees in SoC designs using GALS

  more on industry focus >>
   
 
Web Exclusives
   

Power-management solutions for telecom systems improve performance, cost, and size

Changing the network security playing field

WiMAX “personality pack” provides complete IEEE802.16 functionality

LED: A tiny light source with a bright future

SSDs: Carving a Niche in the Consumer and Enterprise Markets

  more on web exclusives >>
   
 
     
     
   
     
 
Semiconductors
   

Simulating the effect of blockers on data converter performance in wideband receivers

Decrease processor power consumption using a CPLD

Taking full advantage of new, low-power MCUs

Power train integration for 2007 and beyond: The true dawn of multi-chip modules

Wireless network options for industrial applications

  more on semiconductors >>
   
 
Field Applications
   

Test Equipment

Power Sources/Circuit Protection

Advanced Signal Processing Dramatically Improves Capability of Artificial Limbs

Voice Interface Technology for Hands-free Function in Automobiles

LXI: A Technology Leap for Test Instrumentation

  more on field applications >>
   
 
     
     
   
     
     
 
INDUSTRY LINKS
   
Photonics Association (Singapore)
bullet Singapore Industrial Automation Association (SIAA)
   
 
 

 

 
         
 

 
 
 
 
 
© 2008 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.